GL approved Good ambient temperature cure (see BP10 for lower temperatures) Suitable for composite to composite and composite to metal bonding Fast curing

Suitable for bonding at lower temperatures down to 5°C (Max. 20°C) Same mechanical performance as BP20 Low temp. curing extends the repair season

GL Approved Reduced wastage and mess Uses the LR635 resin system Handy pack sizes

Suitable for the Epikote LR635 Epoxy resin system Different sizes available

Suitable for temperatures down to 5°C (max. 20°C) Comes in handy foil bags Suitable for hand layup Extends repair season  

Cartridge dispensed epoxy infusion system Easy mixing Less waste/mess Designed to work with the infusion kit from DD compound

Suitable for the Epikote LR636 Epoxy resin system Different sizes available  

Hardener for Epikote Resin MGSLR635  

Solvent free epoxy based bonding paste Wide range of applications Suitable for bonding laminates, woods, metallic and mineral components Excellent sag resistance Suitabl...

Epoxy based laminating resin system Contains neither solvents or fillers Used to process glass, carbon and aramid fibres

Hardener for Epikote Resin MGS LR285 Hobbock  

Low viscous resin system Can be used for processing glass, aramid fibres and carbon