MGSBP20 Epoxy Bonding Paste | 0.486kg | Box of 12

  • GL approved
  • Good ambient temperature cure (see BP10 for lower temperatures)
  • Suitable for composite to composite and composite to metal bonding
  • Fast curing
SKU: MGSBP20/BOX
Quantity:

Description

BP20 is especially suited for fast cure bonding in composite to composite and composite to metal application. Bonding paste 20 is easy to use for repair and backfilling.

It has a good degree of curing in ambient temperatures. GL approved.