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Solvent free epoxy based bonding paste Wide range of applications Suitable for bonding laminates, woods, metallic and mineral components Excellent sag resistance Suitabl...

Epoxy based laminating resin system Contains neither solvents or fillers Used to process glass, carbon and aramid fibres

Hardener for Epikote Resin MGS LR285 Hobbock  

Hardener for MGSBPR135G Bonding Paste  

Low viscous resin system Can be used for processing glass, aramid fibres and carbon

Hardener for Epikote Resin MGSRIMR035C  

Two component toughened methacrylate adhesive Cures at room temperature Suitable for general purpose and rapid assembly Application on a range of susbstances

Two component fast curing methacrylate adhesive Designed to accelerate structural bonding Provides high toughness and resilience

GL Approved Reduced wastage and mess Uses the LR635 resin system Handy pack sizes

Reduced wastage and mess Uses the LR633 resin system Handy pack sizes  

Activator for Alexit Bladerep Pore Filler 3K

Safe and effective way to provide heat to a specific temperature Heats up to a maximum temperature of 90°C Designed with a highly flexible, durable light material 7mm...